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Wafer Size
To 6 inches
To 155mm
Index Stepping Range
.00025" to wafer diameter
6 microns to diameter
Minimum Index Step
.000125 inch
3 microns
Cutting Feed Speed
0.05 to 12 inches/seconds
1.25 to 300 mm/seconds
Return Stroke
to 12 inches/seconds
300 mm/seconds
Spindle Index Repeatability
.00016 inch
4 microns
Chuck Flatness
.0004 inch across six inches
10 microns over 155 mm
Cutting Depth Range
Blade limited
Cutting Depth Increments
.00025 inch
6 microns
Chuck Height Range
0.50 inch
13 mm
Chuck Rotation
0 to 120 degrees
Chuck, Fine Adjustment
+,- 3 degrees
Rotation Resolution
.0025 degrees
Microscope Magnification
60X Monocular or Split Field TV
Cutting Wheels Diameter
2 inches to 2.2 inches
50 to 56 mm
Wheel Coolant Consumption
1/2 to 1 gpm
2 to 4 lit/min
Cooling Water Spindle
6 gph
24 lit/hr
Wheel Coolant Pressure
30 psi
2 Kg/cm2
Vacuum
20 inches Hg min
500 mm Hg
Air
85 psi, 4 CFM
6 Kg/cm2, 120 lit/min
Base Dimensions
32 inches x 26 inches
81 cm x 65 cm
Height (with TV)
25 inches
73 cm
Weight
220 lbs.
100 Kg
Power
120 VAC 50/60 Hz, 1500 w
Spindle
Air Bearing 350 w
Spindle Speed
5,000 to 45,000 rpm
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